With global investment in AI infrastructure accelerating and demand for High Bandwidth Memory (HBM) and AI chips surging, the need for faster and more precise semiconductor inspection is growing rapidly. Rayence, a leading global manufacturer of digital X-ray detectors, has introduced its industrial high-speed CMOS X-ray detector, the “Flash Series,”…

Qualcomm Technologies has leveraged the CMP180 radio communication tester from Rohde & Schwarz to validate advanced multi-antenna capabilities in its next-generation Wi-Fi 8 platforms, including support for 5×5 MIMO across the 2.4, 5 and 6 GHz bands. These advanced 5×5 MIMO architectures enable Wi-Fi 8 platforms to deliver greater network…

Innatera, a pioneer in brain-like neuromorphic computing for ultra-low-power intelligence at the sensor edge, has selected Synopsys, Inc. to support the design and validation of its next-generation neuromorphic microcontrollers. Synopsys’ advanced electrostatic discharge (ESD) and power integrity analysis solutions will enable Innatera to scale production and meet rising demand for…

Semiconductor startup OptoML has raised $1.8 million in a Pre-Series A funding round led by venture capital firms Bluehill.VC and A99, according to media reports. The funding is expected to support the company’s efforts in advancing AI-focused semiconductor solutions, particularly in the system-on-chip (SoC) segment. OptoML is developing technologies aimed…

Vishay Intertechnology, Inc. has introduced the VOx619A series of phototransistor optocouplers engineered to deliver a high, linear current transfer ratio (CTR) across a wide temperature range while operating at a low forward current of just 0.5 mA. Designed for reliable performance in demanding environments, the devices support operation up to…

Rohde & Schwarz, in collaboration with Broadcom, will display its CMX500 multi-technology multi-channel signaling tester at MWC Barcelona 2026 with newly added Wi-Fi 8 (IEEE 802.11bn) testing capabilities. The setup at the Rohde & Schwarz booth (5A80) will validate a prototype Wi-Fi 8 device from Broadcom, showcasing physical layer features…

Renesas Electronics Corporation, a leading provider of advanced semiconductor solutions, has introduced three new System-on-Chip (SoC) technologies designed for automotive multi-domain electronic control units (ECUs). These solutions integrate advanced AI processing and chiplet capabilities, forming a core platform for next-generation automotive electrical and electronic (E/E) architectures. The company showcased these…

The CMX500 one-box signaling tester from Rohde & Schwarz has evolved into a comprehensive, all-in-one platform for NTN testing, supporting NR-NTN, NB-NTN and Direct-to-Cell (D2C/DTC) technologies within a single instrument. It enables users to validate both network infrastructure and devices using one setup, eliminating the need for multiple test systems,…

STMicroelectronics, a global leader in semiconductor technologies, has unveiled the Stellar P3E, the automotive industry’s first microcontroller to feature built-in AI acceleration for edge intelligence. Developed to support the next generation of software-defined vehicles, Stellar P3E enables the consolidation of multiple functions into X-in-1 Electronic Control Units (ECUs), helping automakers…

Texas Instruments (TI) has strengthened its presence in India with the inauguration of a new, State-of-the-Art Research and Development (R&D) Centre in Bengaluru, reinforcing the company’s long-term commitment to semiconductor innovation and advanced engineering in the country. The new facility was inaugurated by Hon’ble Union Minister for Electronics and Information…

DigiKey, the global distribution leader of electronic components and automation products, announced a significant expansion in 2025, substantially increasing its in-stock products available for same-day shipment. DigiKey’s expansion includes the addition of more than 108,000 new stocking products, with over 1.6 million new products added to the DigiKey system overall,…

Siemens has announced the acquisition of ASTER Technologies (“ASTER”), a privately held leader in printed circuit board assembly (PCBA) test verification and engineering software. This strategic acquisition brings ASTER’s advanced “shift-left” Design for Test (DFT) capabilities directly into Siemens’ Xpedition and Valor software, key components of the Siemens Xcelerator portfolio.…