Cyient Semiconductors has announced the successful completion of its USD $85 million majority-stake investment in Kinetic Technologies, a global provider of power semiconductor solutions. With this development, Kinetic Technologies becomes part of Cyient Semiconductors as a proven, revenue-generating company specializing in custom solutions and Application-Specific Standard Products (ASSPs). The company…

Quest Global, the world’s largest independent pure-play engineering services company, has announced the acquisition of India-based semiconductor design services firm BITSILICA, a strategic move that strengthens its semiconductor portfolio and expands support for global chip customers. The acquisition also accelerates Quest Global’s vision of building full-stack engineering capabilities spanning concept-to-silicon-to-software.…

Thanjavur, long celebrated as the “Rice Bowl of South India,” has always stood at the intersection of heritage, knowledge, and innovation. Home to the iconic Brihadiswara Temple, a millennium-old symbol of engineering excellence and visionary design, the region continues to inspire new pathways of progress. Building on this rich legacy,…

Agileo Automation, a global leader in control and connectivity solutions for semiconductor manufacturing, has announced the launch of Agil’EDA, its new Equipment Data Acquisition (EDA/Interface A) software. Designed for semiconductor equipment OEMs, the solution helps meet the growing demand for high-performance connectivity across tier-one fabs and advanced packaging environments. As…

Vishay Intertechnology has introduced the Vishay Sfernice 40 LHE, a compact, ready-to-deploy linear position sensor engineered for high-accuracy displacement sensing in harsh operating conditions. Built on non-contact Hall effect technology, the device offers linearity down to ±1% across the full stroke, 12 µm resolution, and a lifecycle exceeding 10 million…

FormFactor, Inc., a leading provider of RF probe stations and probe cards, and Rohde & Schwarz, a global leader in test and measurement, have announced a strategic co-marketing partnership as part of FormFactor’s MeasureOne partner program, strengthening their capabilities in RF testing. This solution-integration initiative is designed to deliver validated,…

Arteris, Inc., one of the leading providers of semiconductor technology focused on accelerating AI innovation, has announced that its FlexNoC network-on-chip (NoC) interconnect IP has been licensed and deployed by Renesas Electronics for its latest R-Car Gen 5 SoC series. Designed for advanced driver-assistance (ADAS) and automated driving systems, these…

Texas Instruments (TI) has introduced new isolated power modules designed to enhance power density, efficiency, and safety across applications such as data centers and electric vehicles (EVs). The UCC34141-Q1 and UCC33420 modules incorporate TI’s proprietary IsoShield technology, a multichip packaging solution that delivers up to three times higher power density…

STMicroelectronics, a global semiconductor leader serving a wide range of electronics applications, has introduced a new ultra-wideband (UWB) chip family designed to support the next-generation wireless standard for precise device localization and tracking over distances of several hundred meters. The new UWB platform combines extended range, higher processing capability, and…

Polymatech Electronics, a pioneer in semiconductor and optoelectronic technologies, will unveil its cutting-edge Chip-on-Board (COB) LED solutions at Light + Building 2026, the world’s premier trade fair for lighting and building services, held in Frankfurt, Germany, from March 8-13, 2026. Attendees are invited to visit Hall 8, Booth E39 to…

With global investment in AI infrastructure accelerating and demand for High Bandwidth Memory (HBM) and AI chips surging, the need for faster and more precise semiconductor inspection is growing rapidly. Rayence, a leading global manufacturer of digital X-ray detectors, has introduced its industrial high-speed CMOS X-ray detector, the “Flash Series,”…

Qualcomm Technologies has leveraged the CMP180 radio communication tester from Rohde & Schwarz to validate advanced multi-antenna capabilities in its next-generation Wi-Fi 8 platforms, including support for 5×5 MIMO across the 2.4, 5 and 6 GHz bands. These advanced 5×5 MIMO architectures enable Wi-Fi 8 platforms to deliver greater network…