Texas Instruments (TI) has introduced a new battery monitoring solution designed to bring advanced intelligence, real-time diagnostics, and predictive capabilities to electric vehicle (EV) and energy storage system (ESS) applications. The company’s latest device, the BQ79826Z-Q1, combines high-cell-count monitoring with integrated electrochemical impedance spectroscopy (EIS) technology, enabling deeper insights into…

Mitsubishi Electric Corporation has partnered with Semikron Danfoss Elektronik GmbH & Co. KG to develop a new standard package for power semiconductor modules featuring integrated 3-level circuits. The solution is intended for use in industrial drive equipment and renewable energy systems, where demand for efficient power conversion technologies continues to…

Cadence and the Indian Institute of Technology Delhi (IIT Delhi) have joined forces to establish the IIT Delhi–Cadence Innovation Lab, a multidisciplinary centre designed to nurture the next generation of semiconductor professionals in India. The facility will provide students, researchers and emerging startups with access to advanced AI-powered electronic design…

Infineon Technologies, a leading provider of power systems and IoT solutions has joined NVIDIA’s MGX AI Factory ecosystem to advance power delivery for next-generation AI data centers. Through its advanced power management technologies, Infineon will support NVIDIA’s MGX architecture and 800 VDC power framework: an open, modular reference design created…

At PCIM Europe 2026 in Nuremberg, Infineon Technologies AG will present its comprehensive semiconductor portfolio designed to enable future-ready power infrastructure, AI data centers, robotics, and electromobility. Positioned in Hall 7, Booth 470, the company will showcase a wide range of power system solutions spanning silicon (Si), silicon carbide (SiC),…

Vishay Intertechnology has introduced four new series of unidirectional and bidirectional 3000 W PAR and TRANSZORB surface-mount transient voltage suppressors (TVS) featuring the newly developed DFN6546A package with wettable flanks. Designed for automotive and industrial applications, the newly launched Automotive Grade T3KNxxA and T3KNxxCA series are AEC-Q101 qualified and support…

HrdWyr, a global fabless semiconductor product company, has announced the successful closure of its $13 million Series A funding round. The round was led by Ideaspring Capital, with participation from Singularity AMC, Avatar Growth Capital, and Persistent Systems. The funding will support the advancement of HrdWyr’s AI-native System-on-Chip (AISoC) products…

In a joint measurement trial, Rohde & Schwarz and Greenerwave demonstrated that a near-field measurement system can capture the complete radiation pattern of a 50 cm Ku band electronically steerable array (ESA) SATCOM antenna in approximately 30 minutes. The results closely aligned with simulation models within a one-decibel margin, highlighting…

STMicroelectronics is strengthening its position in the fast-growing space chips market, setting a target of generating more than $3 billion in cumulative revenue from its space-related semiconductor business between 2026 and 2028. The company’s space chips strategy is closely aligned with the rapid expansion of low-Earth orbit (LEO) satellite networks,…

Entegris Inc. has announced the appointment of Sukhi Nagesh as its Chief Financial Officer (“CFO”), effective May 18, 2026. The company, which provides advanced materials and process solutions for the semiconductor and broader high-technology sectors, said the move strengthens its leadership team as it continues to expand its global operations.…

Atomera Incorporated has announced an expanded collaboration with Synopsys, a leader in engineering solutions from silicon to systems, to advance gallium nitride (GaN) device modeling for radio frequency (RF) and power semiconductor applications. This initiative builds on the companies’ long-standing collaboration involving Synopsys’ Sentaurus TCAD and Atomera’s MSTcad toolset, and…

Siemens has announced the continuation of its collaboration with TSMC to advance innovation in AI-powered automation and next-generation semiconductor design enablement. Building on previous partnership successes, Siemens is expanding its support across the EDA workflow from automated resolution of design rule violations to certified solutions for the most advanced process…