Rapidise, a leading India-based Original Design Manufacturer (ODM), showcased its innovative RISE Modules and Edge AI Box at the Indian Mobile Congress (IMC) 2025, advancing next-generation Camera Systems, Vision AI, Edge Computing, and scalable engineering solutions.
Built on Qualcomm’s cutting-edge SoC platforms, these RISE Modules empower OEMs, system integrators, and solution providers to drastically cut time-to-market while developing smarter, connected, and future-proof devices.
Engineering IP Advantage and Modular Scalability
Rapidise provides ready-to-use engineering IPs, including reference-design hardware for AI cameras, dash cams, IP cameras, and Edge AI Boxes, all powered by Qualcomm’s QCS 6125, SM 6225, QCS 5430, QCS 6490, and QCS 8550 series as the core technology foundation for swift product launches. The modular, pin-to-pin upgradable design enables seamless performance shifts from 3.5 TOPS to 12 TOPS, delivering 10+ year lifecycle sustainability, superior scalability, and lower total cost of ownership.
Driving Faster Innovation
Rapidise functions as a strategic accelerator for rapid prototyping and production, streamlining the entire ODM value chain – from concept to commercialization. Its plug-and-play modularity and pre-validated reference designs remove design friction, enabling partners to deliver differentiated, AI-powered products across security, consumer electronics, healthcare, automotive, and Industry 4.0 ecosystems.
Leadership Insights
“With Rapidise, we are redefining how modular innovation drives value in the connected ecosystem. Our goal is to empower OEMs to innovate faster and scale smarter, without reinventing their hardware foundations.”
— Brijesh Kamani, CEO & MD, Rapidise
“Our ‘Made-in-India’ RISE portfolio is engineered to unlock the power of Qualcomm’s advanced SoCs, enabling white-label-ready Vision AI solutions that support rapid market expansion and sustainable product growth.”
— Ashish Chinthal, CBO, Rapidise
“By engineering the RISE X, Y, and Z series on Qualcomm’s high-performance platforms, we’ve built a versatile foundation for AI-driven products that blend performance with energy efficiency—future-proofed for the next decade of intelligent devices.”
— Sheshadri Joshi, VP – Hardware Engineering, Rapidise
“Qualcomm is proud to collaborate with Rapidise in powering their module platforms and product solutions with our advanced SoC technologies. This partnership reflects our shared commitment to accelerating intelligent-edge innovation and enabling scalable, AI-driven solutions for OEMs across industries. It underscores Qualcomm’s dedication to fostering cutting-edge design and engineering excellence in India.”
— Manmeet Singh, Senior Director & India Business Head – Automotive, Connectivity, Broadband & IoT, Qualcomm India
