Cirrus Logic, a leader in high-performance audio and mixed-signal semiconductor solutions, has announced an expanded strategic collaboration with GlobalFoundries, one of the world’s leading semiconductor manufacturers. The partnership will accelerate the development of advanced chip technologies designed to deliver higher efficiency, performance, and reliability for next-generation devices ranging from smartphones…

Nordson Electronics Solutions, a global leader in precision electronics manufacturing technologies, is all set to present its latest high-yield semiconductor packaging solutions at SEMICON Taiwan 2025, taking place September 10–12 at booth i2326. Visitors will experience the ASYMTEK Vantage dispensing system, equipped with dual IntelliJet jet valves for maximum productivity…

FuriosaAI, a semiconductor company pioneering next-generation AI compute solutions, has raised $125 million in a Series C bridge funding round. The investment comes amid surging global demand for high-performance, energy-efficient AI infrastructure. The company recently achieved a major milestone with a design win from LG AI Research, which adopted Furiosa’s…

Ecolab Inc. has entered a definitive agreement to acquire Ovivo’s Electronics business, a global leader in ultra-pure water technologies for the semiconductor industry. The acquisition, valued at approximately $1.8 billion in cash (subject to customary adjustments), will enhance Ecolab’s high-tech water solutions portfolio by combining Ovivo’s breakthrough purification systems with…

Oxmiq Labs Inc., a next-generation GPU software and IP company founded by globally renowned GPU architect Raja Koduri, has announced its public launch after two years of intensive IP development. Koduri, a visionary with decades of experience leading GPU innovation, has assembled a world-class team of GPU and AI architects…

Infineon Technologies AG has announced a strategic partnership with UL Solutions to enhance functional safety compliance in the automotive sector. The collaboration is designed to support original equipment manufacturers (OEMs) in achieving ISO 26262 certification, an international standard governing functional safety in electrical and electronic systems in vehicles. The partnership…

Infinitesima is proud to announce the launch of a three-year collaborative development project aimed at enhancing the capabilities of its Metron3D 300 mm in-line wafer metrology system. The project includes leading industry partners such as ASML and Imec, and will focus on metrology innovations for advanced semiconductor applications, including hybrid…

Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling new Universal Flash Storage(2) (UFS) Ver. 4.1 embedded memory devices, reinforcing its leadership in high-performance storage. Engineered to meet the demands of next-generation mobile applications, including advanced smartphones with on-device AI, the new devices offer…

Wolfspeed, Inc. has announced the appointment of Gregor van Issum as Chief Financial Officer (CFO), effective September 1, 2025. Van Issum succeeds Kevin Speirits, who has served as Interim CFO and will remain with the company during the transition period to ensure continuity and support. Van Issum will relocate to…

Anritsu Corporation is pleased to announce that its receiver test (SINK test) solution for the latest DisplayPort 2.1 standard has been officially certified by the Video Electronics Standards Association (VESA), the international body responsible for video interface standards. The certified solution integrates Anritsu’s Signal Quality Analyzer-R MP1900A with automation software…

Scrona AG, a pioneer in high-resolution electrohydrodynamic (EHD) inkjet printing, has announced a strategic distribution agreement with K1 Solution Co., Ltd., a leading provider of advanced semiconductor manufacturing solutions in South Korea. Under the agreement, K1 Solution will serve as the official distributor of Scrona’s multi-nozzle EHD printing systems across…

AIXTRON SE Fraunhofer IISB in Erlangen and bimanu Cloud Solutions GmbH in Neuss will jointly improve energy efficiency in the production of semiconductor layers based on silicon carbide (SiC). To this end, the partners are cooperating in the project “Increasing Energy Efficiency in SiC Epitaxy”, which is funded by the…