Rigaku Corporation, a global leader in X-ray metrology systems and a Group company of Rigaku Holdings Corporation (Akishima, Tokyo; CEO: Jun Kawakami), has begun full-scale commercial production of the XTRAIA XD-3300, a high-resolution microspot X-ray diffraction system designed specifically for the semiconductor industry.
As the industry accelerates toward generative AI and hyperscale data center demands, semiconductor scaling and 3D integration are evolving rapidly. This shift is driving increased demand for next-generation memory (e.g., high-bandwidth memory and 3D DRAM) and advanced logic devices at the 2nm node and beyond. To achieve optimal performance, manufacturers are adopting complex superlattice structures—notably using Si/SiGe (silicon/silicon-germanium) processes.
Rigaku’s XTRAIA XD-3300 directly addresses this need. It is the only metrology system in the world capable of performing non-destructive, high-resolution diffraction measurements of superlattice structures on microscopic wafer pads. Developed entirely in-house—including its X-ray optics, detector, and diffraction software—the XD-3300 represents a breakthrough in both capability and speed.
Its proprietary X-ray optical system, combining ultra-high-performance mirrors with bent crystals, enables measurements up to 100 times faster than previous systems. Tasks that once required several hours can now be completed within minutes. Complementing the hardware is Rigaku’s advanced diffraction software, which delivers precise numerical assessments of superlattice periodicity and boundary-surface integrity.
To meet anticipated global demand, Rigaku has expanded production capacity with a new facility and 15 dedicated manufacturing booths. The company projects FY2025 sales of over JPY 1 billion (USD 6.9 million), with further growth expected—targeting JPY 10 billion (USD 69 million) in sales by FY2030 through global deployment to leading semiconductor manufacturers.
Kiyoshi Ogata, Senior Executive Vice President and Product Division General Manager, offered the following remarks:
XTRAIA XD-3300 represents the crystallization of Rigaku’s leading-edge technologies. We have already delivered this system to multiple leading-edge semiconductor manufacturers that are developing next-generation semiconductors using Si/SiGe superlattices. As manufacturers move toward mass production of next-generation semiconductors, Rigaku expects to expand deliveries of XTRAIA XD-3300. We are confident that high-resolution, non-destructive measurements using X-ray diffraction will become increasingly important in the months and years ahead as a core technology supporting quality control in next-generation semiconductor production.
Features of XTRAIA XD-3300
- Direct visual non-destructive observation of microscopic structures with high-resolution
Provides detailed, non-destructive diffraction of the interiors of nanoscale, multi-layer structures, on fine pads less than 40 µm across. World-top-class resolution feeds directly into improved yield. - 100-fold increase in measurement speed compared with previous models
By using X-ray convergence optics with the latest mirror technology, the XTRAIA XD-3300 delivers the world’s brightest small-spot X-ray beam. This enables it to complete vast measurement tasks with blazing speed. Its high throughput makes easily adaptable into production lines. - Incorporates of the only software capable of analyzing diffraction of complex superlattice structures
The advanced diffraction software delivers accurate numerical analysis of the periodicity and boundary-surface quality of Si/SiGe and other multilayer structures. This powerful capability supports both high volume manufacturing and the development phase of leading-edge memory and logic semiconductor devices.
