Siemens has announced the continuation of its collaboration with TSMC to advance innovation in AI-powered automation and next-generation semiconductor design enablement. Building on previous partnership successes, Siemens is expanding its support across the EDA workflow from automated resolution of design rule violations to certified solutions for the most advanced process technologies.
“Our continued collaboration with TSMC exemplifies Siemens’ commitment to delivering AI-driven automation and advanced semiconductor design capabilities that accelerate our customers’ ability to innovate at the most advanced process nodes,” said Ankur Gupta, executive vice president, EDA IC Software, Siemens Digital Industries Software. “By combining our AI innovations with TSMC’s leading-edge process technologies, we’re helping customers reach new levels of speed, accuracy and design confidence.”
“TSMC greatly values our longstanding partnership with Siemens, a key member of our Open Innovation Platform (OIP) ecosystem, as we work together to enable next generation semiconductor designs,” said Aveek Sarkar, director of the ecosystem and alliance management division at TSMC. “Through joint advancements in AI-powered EDA tools and certified design enablement, we continue to help customers achieve exceptional results on our latest technologies while driving energy-efficient chip innovation, paving the way for advancements in the semiconductor industry during this transformative era of AI.”
AI-Powered Chip Design Solution
Siemens is collaborating with TSMC to advance AI-driven automation across EDA workflows using the newly introduced Fuse EDA AI System, a domain-specific agentic AI platform for semiconductor design. Through this partnership, TSMC is working with Siemens to improve productivity in custom IC design by enabling multi-step, multi-tool automation for DRC-focused physical verification using Siemens’ Calibre software. The collaboration also helps designers rapidly access design data, receive intelligent recommendations, and execute commands in real time, accelerating digital design cycles through Siemens’ Aprisa software.
3D IC design solution and TSMC 3DFabric
For TSMC 3DFabric technologies, Calibre 3DStack supports multiple advanced verification flows, including interface checking for alignment and connectivity validation, inter-chiplet DRC flows for 3D-aware design rule checks on interposers, inter-chiplet antenna analysis for evaluating 3D system behavior, and 3DPERC flows for point-to-point resistance extraction and current density analysis across 3D systems. These capabilities are implemented using 3Dblox syntax to ensure consistency across complex 3D IC designs.
In addition, Calibre 3DThermal enables evaluation of thermal impacts at the die level within 3D IC stacking environments and has achieved TSMC certification for both static and transient thermal analysis. This allows designers to assess thermal behavior alongside complex power delivery networks in advanced 3D IC architectures, supporting more informed and reliable design decisions.
Advanced node technology enablement
Siemens and TSMC are also collaborating on next-generation process node enablement. Siemens’ Calibre nmPlatform has been certified for TSMC’s 3nm, 2nm, A16, and A14 process technologies. In addition, the Solido Simulation Suite is certified for SPICE-level accuracy across TSMC’s N3A, N2P, A16, and A14 nodes, enabling reliable verification of analog, mixed-signal, RF, standard cell, and memory designs on advanced process technologies.
This collaboration further extends into TSMC’s custom design reference flow (CDRF) for the A14 process. Siemens’ Solido Simulation Suite supports reliability-aware simulation capabilities that address IC aging, real-time self-heating effects, and Safe Operating Area (SOA) analysis. In parallel, the TSMC A14 CDRF incorporates the Solido Design Environment to enable advanced variation-aware verification, improving design sensitivity analysis and supporting automated cell optimization.
Siemens’ mPower analog solution is also certified for transistor-level EM/IR sign-off on TSMC’s N2P process, highlighting its readiness for next-generation advanced-node designs. Meanwhile, Siemens’ Aprisa platform has achieved TSMC N2P Integrated Tool Certification, demonstrating its capability for advanced-node digital implementation flows.
Beyond traditional semiconductor design, Siemens tools are also enabled for the development and verification of TSMC Compact Universal Photonic Engine (COUPE) technology. The joint silicon photonics initiative leverages Siemens’ Innovator3D IC, Calibre 3DStack, L-Edit, Solido Simulation Suite, and Calibre Interactive tools to support end-to-end design, implementation, and verification workflows for TSMC-COUPE technology.
Siemens Digital Industries Software enables organizations of all sizes to accelerate digital transformation through software, hardware, and services delivered via the Siemens Xcelerator business platform. Leveraging advanced software capabilities and a comprehensive digital twin, Siemens helps companies optimize design, engineering, and manufacturing processes to transform innovative ideas into sustainable products of the future. Spanning chips to complete systems and covering the full product lifecycle across industries, Siemens Digital Industries Software drives end-to-end transformation, accelerating innovation at every stage.
