Agileo Automation, a global leader in control and connectivity solutions for semiconductor manufacturing, has announced the launch of Agil’EDA, its new Equipment Data Acquisition (EDA/Interface A) software. Designed for semiconductor equipment OEMs, the solution helps meet the growing demand for high-performance connectivity across tier-one fabs and advanced packaging environments.
As semiconductor manufacturing advances towards greater automation and data-driven optimization, fab owners increasingly expect EDA support alongside traditional SECS/GEM connectivity for production tools. Agil’EDA intelligently separates equipment control from data acquisition, enabling structured, high-frequency data collection without disrupting critical equipment operations.
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Built for long-term deployment, Agil’EDA fully supports the widely adopted EDA Freeze 2 (SOAP/XML) standard and is purpose-built to ease the transition to Freeze 3 (gRPC/protocol buffers). Expected in mid-2026, the next EDA freeze will deliver significantly higher data throughput and lower latency, helping semiconductor equipment OEMs prepare for faster, more efficient fab connectivity. Agileo has already validated its Freeze 3 implementation during the SEMI Standards Meetings held in November 2024, reinforcing the platform’s future-ready architecture.
Equipped with robust cybersecurity features, including encrypted communications and secure authentication, Agil’EDA is available either as a stand-alone solution for existing equipment software or as a pre-integrated module within Agileo’s A²ECF-SEMI framework. When combined with Agil’GEM and Agil’GEM300, it delivers a comprehensive connectivity ecosystem that helps semiconductor equipment OEMs significantly reduce time to market.
“The key value for OEMs is a fast adoption path to a future-ready EDA architecture,” explains Marc Engel, chief executive officer of Agileo Automation. “By integrating Freeze 3 requirements in Agil’EDA architecture from the start, we address OEMs’ current needs while preparing them for future semiconductor manufacturing requirements.”
