Vishay Intertechnology, Inc. has introduced the VOx619A series of phototransistor optocouplers engineered to deliver a high, linear current transfer ratio (CTR) across a wide temperature range while operating at a low forward current of just 0.5 mA. Designed for reliable performance in demanding environments, the devices support operation up to…

Flip Electronics, a global leader in authorized electronic components, today announced the appointment of Tom Rau as Director, Channel Engagement. A respected industry veteran, Tom brings a proven track record of accelerating channel growth and fostering stronger collaboration across partner ecosystems to support the company’s continued expansion. In his new…

ACS has officially formalized its designation as a Siemens Solutions Partner – Drives Automation. Through this expanded partnership, ACS combines its expertise in packaging, thermal management, and systems integration with Siemens’ advanced drive technology to deliver fully integrated motor drive and automation solutions for aerospace, automotive, and industrial applications. The…

STMicroelectronics, a global leader in semiconductor technologies, has unveiled the Stellar P3E, the automotive industry’s first microcontroller to feature built-in AI acceleration for edge intelligence. Developed to support the next generation of software-defined vehicles, Stellar P3E enables the consolidation of multiple functions into X-in-1 Electronic Control Units (ECUs), helping automakers…

Mitsubishi Electric India, a global leader in electrical and electronic equipment, has inaugurated a new air conditioner and compressor manufacturing facility in Chennai, Tamil Nadu. The facility was virtually inaugurated by the Hon’ble Chief Minister of Tamil Nadu, Thiru M.K. Stalin, through a plaque unveiling ceremony, held in the presence…

DigiKey, the global distribution leader of electronic components and automation products, announced a significant expansion in 2025, substantially increasing its in-stock products available for same-day shipment. DigiKey’s expansion includes the addition of more than 108,000 new stocking products, with over 1.6 million new products added to the DigiKey system overall,…

Rohde & Schwarz invites visitors to Mobile World Congress 2026 in Barcelona to visit its booth and engage with company experts while exploring solutions for the next generation of wireless technologies. Showcased under the motto “Enabling Connections, Empowering Innovations,” the company’s portfolio will be on display at Fira Gran Via,…

Micross has announced the commercial launch of its Standard-Performance Nuclear Event Detector (NED), a next-generation radiation detection solution that delivers enhanced sensitivity, faster response times, and improved system efficiency. Designed to safeguard mission-critical electronics, the new NED supports demanding applications such as aircraft, unmanned aerial systems, defense weapons platforms, satellites,…

Rohde & Schwarz is inviting the global EMC community to take part in an important discussion on preparing for the next generation of EMC testing. The virtual conference, Demystifying EMC 2026, will examine key industry challenges, including evolving regulatory and standards requirements, emerging test methodologies, and solutions designed to accelerate…

Siemens has announced the acquisition of ASTER Technologies (“ASTER”), a privately held leader in printed circuit board assembly (PCBA) test verification and engineering software. This strategic acquisition brings ASTER’s advanced “shift-left” Design for Test (DFT) capabilities directly into Siemens’ Xpedition and Valor software, key components of the Siemens Xcelerator portfolio.…

Tau, a leader in advanced electrification, introduced Ion, its breakthrough software-defined power electronics platform, at CES 2026. Engineered for scalability and cross-industry adoption, the Tau Ion platform supports high-performance power conversion across mobility, energy, industrial, and grid applications, powering everything from charging systems and motor drives to data centers and…

Infineon Technologies AG and Flex are advancing their collaboration to accelerate the evolution of software-defined vehicles (SDVs). At CES 2026, the two companies will unveil the Zone Controller Development Kit, a modular platform for Zone Control Units (ZCUs) designed to fast-track the creation of SDV-ready electrical and electronic (E/E) architectures.…