With global investment in AI infrastructure accelerating and demand for High Bandwidth Memory (HBM) and AI chips surging, the need for faster and more precise semiconductor inspection is growing rapidly. Rayence, a leading global manufacturer of digital X-ray detectors, has introduced its industrial high-speed CMOS X-ray detector, the “Flash Series,” specifically designed for semiconductor AXI (Automated X-ray Inspection) systems and high-speed 3D X-ray CT inspection platforms. The company aims to expand its presence in the industrial AXI market with this cutting-edge solution.
AI chips and HBM devices feature complex, multi-layered, and stacked structures, making micron-level internal defect detection extremely challenging. Since detecting these microscopic defects is critical to semiconductor yields, the demand for advanced inspection technologies beyond conventional AOI such as AXI and 3D X-ray CT, continues to rise.
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Semiconductor manufacturers are increasingly focusing on high-speed 3D X-ray CT inspection systems that reduce inspection times while accurately identifying internal defects. This trend highlights the growing importance of high-resolution, high-speed CMOS detectors capable of performing reliably under high-output, high-power X-ray conditions, now considered essential technology in modern semiconductor manufacturing.
The “Flash Series” is a high-speed CMOS X-ray detector platform engineered for inline semiconductor inspection. Commercialized in 2021, it has been supplied to leading global AXI and 3D X-ray CT system manufacturers, supporting advanced semiconductor production lines. As demand for AI chip and HBM inspection grows, Rayence has strengthened long-term partnerships with top inspection-equipment companies and is scaling up production to meet market needs.
The upgraded “Flash Series” features a 49.5 μm pixel size and supports up to 70 frames per second, providing stable micron-level defect detection in high-throughput semiconductor AXI systems. It is specifically optimized for inspecting HBM and AI chips with fine patterns and complex stacked structures. Integrated into inline AXI and 3D X-ray CT systems, it enables real-time inspection while simultaneously improving production yields across semiconductor lines.
A standout feature of the “Flash Series” is its X-ray durability of up to 20,000 Gy, ensuring reliable operation under the high-output X-ray conditions typical of 3D X-ray CT and advanced AXI applications. This robustness allows faster scanning, extended detector lifetime, reduced replacement cycles, improved uptime, and a lower total cost of ownership for system manufacturers.
With high-speed 3D X-ray CT systems becoming essential for next-generation semiconductor inspection, particularly for AI chips and HBM devices, the demand for durable, high-resolution CMOS X-ray detectors continues to rise. Rayence positions the Flash Series as a key solution for AXI systems, delivering high-speed imaging, precise defect detection, and stable performance under intensive X-ray conditions.
Rayence, the only CMOS X-ray detector manufacturer in Korea, is gaining attention for its strong technological capabilities optimized for industrial inspection environments. As demand for AI- and HBM- focused inspection continues to rise and translates into global equipment orders, its industrial detector revenue is expected to remain stable in the first quarter of this year.
“As AI infrastructure continues to expand and the structural complexity of HBM and AI chips deepens, the detection of microscopic defects using AXI and 3D X-ray CT has become an essential process in semiconductor manufacturing.” said Jaejeong Seo., CEO of Rayence.
“Rayence has continuously supplied high-speed CMOS detectors to global top-tier inspection equipment manufacturers, validating our technology and quality at a world-class level. We will further focus on the industrial X-ray inspection market, advancing next-generation high-speed, high-resolution, and high-durability CMOS detectors to strengthen our position as a key partner in AI semiconductor inspection.”
