Cervoz, a leading provider of industrial-grade storage, memory, and expansion solutions, will feature its newest edge-focused products at Embedded World North America 2025 from November 4–6 at the Anaheim Convention Center (Hall C, Booth #2042). Attendees can explore how Cervoz’s portfolio enhances AI-driven and mission-critical embedded systems by ensuring reliable network connectivity and streamlined interface integration for robust real-world performance.
Edge AI SSDs for Diverse Workloads
At the heart of Cervoz’s exhibition are its Edge AI SSDs, designed to meet the varying performance demands of edge computing applications. Recognizing that edge AI systems require different throughput levels, Cervoz offers a comprehensive NVMe SSD lineup that balances latency, performance, and endurance:
- Gen4x4 – High-performance models optimized for real-time video analytics, high-throughput inference, and edge servers.
- Gen3x4 – Mainstream solutions ideal for AI gateways, automation control, and factory equipment.
- Gen3x2 – Efficient options for lightweight applications including sensors, monitoring terminals, and gateways with moderate workloads.
Capacities from 256GB to 2TB, plus single-sided layouts, heat dissipation solutions, write protection, and power loss protection technology, make Cervoz SSDs adaptable to a wide range of edge deployments.
Comprehensive Memory Solutions from Legacy to AI-Ready
Cervoz offers a comprehensive DRAM module portfolio designed to meet the needs of systems spanning different generations, including support for legacy DDR1–3 series in long-lifecycle industrial platforms and mainstream DDR4–5 modules for advanced edge devices and AI workloads demanding higher bandwidth and stability. The lineup includes wide-temperature models and optional conformal coating for enhanced durability and reliability in rugged industrial settings.
Seamless Expansion and Connectivity Solutions
Cervoz’s connectivity lineup features Mini PCIe, M.2, and PCIe expansion cards, delivering a wide array of industrial interfaces for next-generation embedded systems. Mini PCIe and M.2 modules support Wi-Fi 6E, CAN 2.0 / CAN FD serial connectivity, and LVDS display options, enabling streamlined integration in compact installations. PCIe cards offer high-speed wired networking with Ethernet up to 10 GbE (RJ45, M12, SFP), along with low-profile USB 3.2 Type-A/C combos for flexible expansion needs. These reliable, modular solutions ensure stable, low-latency performance for edge computing, embedded platforms, and AI-driven applications in demanding environments.
Rugged Design for Mission-Critical Applications
Cervoz’s rugged portfolio, MIL-STD-810H certified DDR4/DDR5 DRAM, M.2, and 2.5″ SSDs, is engineered to withstand shock, vibration, and extreme temperatures. Select SSDs also feature power loss protection (PLP) to secure data integrity during unexpected shutdowns, ensuring reliability in mission-critical environments.
With its comprehensive solution portfolio, Cervoz enables embedded and industrial customers to scale seamlessly from proof-of-concept to full deployment, backed by long lifecycle support and dependable performance.
Visit Cervoz at Embedded World North America 2025
When: November 4–6, 2025
Where: Anaheim Convention Center, California
Booth: Hall C, #2042
