Solidigm, a leader in enterprise data storage innovation, has announced the launch of the world’s first Cold-Plate-Cooled enterprise SSD (eSSD), designed to transform server cooling and enable next-generation fanless architectures.
The new Solidigm D7-PS1010 E1.S SSD introduces a single-sided, direct-to-chip liquid cooling technology that cools both sides of the SSD. This breakthrough delivers unprecedented thermal efficiency, reliability, and performance for AI-driven Direct Attach Storage (DAS) workloads, making it one of the fastest PCIe 5.0 SSDs available today.
“Solidigm’s Cold-Plate-Cooled eSSD is a breakthrough for thermal optimization, unlocking tremendous value inside the most advanced GPU servers,” said Greg Matson, Senior Vice President and Head of Products and Marketing at Solidigm. “This is the world’s first single-sided Cold-Plate solution that efficiently cools both sides of the SSD, ensuring maximum performance and seamless scalability in dense AI environments.”
The D7-PS1010 is being qualified with leading server OEMs and ODMs for inclusion in recommended vendor lists. Among early adopters, Supermicro is collaborating with Solidigm to integrate this innovation into its NVIDIA HGX B300-based GPU servers.
“Supermicro is excited to collaborate with Solidigm on their E1.S form factor Cold-Plate-Cooled eSSD technology,” said Vik Malyala, MD Europe, Senior Vice President, Technology and AI, Supermicro. “Their innovative SSDs can be utilized on some of the most advanced liquid-cooled architectures, including the Supermicro NVIDIA HGX B300-based GPU servers supporting compute-intensive workloads.”
By targeting cooling directly to critical SSD components, Solidigm’s cold-plate design reduces the need for bulky cooling infrastructure, cuts operational costs by eliminating fans, and frees up valuable rack space. This enables higher GPU density, improved thermal efficiency, and smaller, more sustainable server designs, all critical for modern AI and data-intensive environments.
Solidigm’s direct-to-chip liquid-cooled eSSD enables data center and edge operators to realize impactful space savings, opening the door for unprecedented GPU scale and density. By minimizing cooling infrastructure requirements, this technology helps to maximize compute deployments even in locations with limited physical footprint.
Designed for leading and next-generation AI server architectures, the Solidigm D7-PS1010 Cold-Plate-Cooled eSSD:
- Addresses the challenges of server thermal management and cost efficiency with hot swappable, single-sided cold-plate cooling technology;
- Enables the full operationalization of intensive AI workloads, mitigating any thermal impact to the storage device;
- Delivers high performance and saturates Gen5 bandwidths to help meet AI workload demands; and
- Reduces operational cost, eliminating fans, maximizing thermal efficiency, and enabling smaller server designs.
Solidigm E1.S 9.5mm and 15mm form factors are available in 3.84TB and 7.68TB capacities.
