Infineon Technologies AG has introduced its new CoolSET System-in-Package (SiP), a compact, fully integrated power controller designed for efficient power delivery of up to 60 W across a universal input voltage range of 85–305 V AC. Housed in a space-saving SMD package, the solution features a high-voltage MOSFET with low RDS(ON), eliminating the need for an external heat sink and reducing overall system complexity. Supporting zero-voltage switching (ZVS) flyback operation, the CoolSET SiP delivers low switching losses and a reduced EMI profile, boosting both system reliability and performance. These attributes make it ideally suited for high-efficiency applications, including major home appliances and AI servers. The integrated controller also streamlines compliance with strict energy efficiency standards, supporting scalable, future-ready power architectures.
The CoolSET SiP combines several advanced components: a 950 V startup cell, an 800 V avalanche-rugged CoolMOS P7 superjunction MOSFET, a ZVS primary-side flyback controller, a secondary-side synchronous rectification (SR) controller, and reinforced isolated communication via Infineon’s proprietary CT Link technology. This high level of integration enables the design of more sophisticated end systems by minimizing the need for discrete components, reducing PCB footprint, and lowering the overall bill of materials. A robust suite of protection features further simplifies system integration, providing engineers with greater flexibility to optimize power designs and enhance the end-user experience.
Availability
Infineon’s CoolSET System in Package (SiP) product samples are available to order. Infineon will show a demo version at PCIM Europe 2025. Further information is available at https://www.infineon.com/cms/en/product/promopages/coolset-sip/
Infineon at the PCIM Europe 2025
PCIM Europe will take place in Nuremberg, Germany, from 6 to 8 May 2025. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booth #470.
